HCF4093_07 Datasheet, PDF (9/13 Pages) STMicroelectronics – QUAD 2-input NAND Schmidt trigger

HCF4093
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 5. Plastic DIP-14 package outline
1. Drawing not to scale.
Table 8. Plastic DIP-14 mechanical data
Symbol
millimeters
Min
Typ
Max
a1
0.51
B
1.39
1.65
b
0.5
b1
0.25
D
20
E
8.5
e
2.54
e3
15.24
F
7.1
I
5.1
L
3.3
Z
1.27
2.54
P001A
Min
0.020
0.055
0.050
inches
Typ
0.020
0.010
0.335
0.100
0.600
0.130
Max
0.065
0.787
0.280
0.201
0.100
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