TD3051 Datasheet, PDF (4/9 Pages) Solid State Optronic – Random Phase Switching

TD3051 Solder Temperature Profile Recommendations
TD3051
Random Phase Switching
600V
Triac Driver
(1) Infrared Reflow:
Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow.
Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device
package should not exceed 250ºC:
G
F
D
E
H
B
A
C
Process
Step
A
B
C
D
E
F
G
H
Figure 1
Description
Preheat Start Temperature (ºC)
Preheat Finish Temperature (ºC)
Preheat Time (s)
Melting Temperature (ºC)
Time above Melting Temperature (s)
Peak Temperature, at Terminal (ºC)
Dwell Time at Peak Temperature (s)
Cool-down (ºC/s)
Parameter
150ºC
180ºC
90 - 120s
230ºC
30s
260ºC
10s
<6ºC/s
(2) Wave Solder:
Maximum Temperature:
Maximum Time:
Pre-heating:
Single Occurrence
(3) Hand Solder:
Maximum Temperature:
Maximum Time:
Single Occurrence
260ºC (at terminal)
10s
100 - 150ºC (30 - 90s)
350ºC (at tip of soldering iron)
3s
© 2013 Solid State Optronics • San José, CA
www.ssousa.com • +1.408.293.4600
Page 4 of 9
TD3051 /H/S/TR
Rev 2.01 (11/12/2013)
001695