S113-X Datasheet, PDF (4/8 Pages) Solid State Optronic – Zero-Volt Cross Switching

S113-X Solder Reflow Temperature Profile Recommendations
S113-X
Zero Cross
800V / 0.8A
AC Solid State Relay
(1) Infrared Reflow:
Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow.
Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device
package should not exceed 250ºC:
G
F
D
E
H
B
A
C
Process
Step
A
B
C
D
E
F
G
H
Description
Preheat Start Temperature (ºC)
Preheat Finish Temperature (ºC)
Preheat Time (s)
Melting Temperature (ºC)
Time above Melting Temperature (s)
Peak Temperature, at Terminal (ºC)
Dwell Time at Peak Temperature (s)
Cool-down (ºC/s)
Parameter
150ºC
180ºC
90 - 120s
230ºC
30s
260ºC
10s
<6ºC/s
(2) Wave Solder:
Maximum Temperature:
Maximum Time:
Pre-heating:
Single Occurrence
260ºC (at terminal)
10s
100 - 150ºC (30 - 90s)
(3) Hand Solder:
Maximum Temperature:
Maximum Time:
Single Occurrence
350ºC (at tip of soldering iron)
3s
© 2015 Solid State Optronics • San José, CA
www.ssousa.com • +1.408.293.4600
Page 4 of 8
S113-X /H/S/TR
Rev 1.00 (02/27/2015)
002404