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SSM04N70BGF-H Datasheet, PDF (2/5 Pages) Silicon Standard Corp. – N-channel Enhancement-mode Power MOSFET
SSM04N70BGF-H
ELECTRICAL CHARACTERISTICS (at Tj = 25°C, unless otherwise specified)
Symbol
BVDSS
∆ BV DSS/∆ Tj
RDS(ON)
Parameter
Drain-source breakdown voltage
Breakdown voltage temperature coefficient
Static drain-source on-resistance
Test Conditions
VGS=0V, ID= 1mA
Reference to 25°C, ID=1mA
VGS=10V, ID=2A
Min. Typ. Max. Units
700 -
-
V
- 0.6 - V/°C
-
- 2.4 Ω
VGS(th)
gfs
IDSS
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Gate threshold voltage
Forward transconductance
Drain-source leakage current
Gate-source leakage current
Total gate charge 2
Gate-source charge
Gate-drain ("Miller") charge
Turn-on delay time 2
Rise time
Turn-off delay time
Fall time
Input capacitance
Output capacitance
Reverse transfer capacitance
VDS=VGS, ID=250uA
VDS=20V, ID=1A
VDS=600V, VGS=0V
VDS=480V ,VGS=0V, Tj = 150°C
VGS=±30V
ID=4A
VDS=480V
VGS=10V
VDS=300V
ID=4A
RG=10Ω , VGS=10V
RD=75Ω
VGS=0V
VDS=25V
f=1.0MHz
2
-
4V
- 2.5 -
S
-
- 10 uA
-
- 100 uA
-
- ±100 nA
- 16.7 - nC
- 4.1 - nC
- 4.9 - nC
- 11 - ns
- 8.3 - ns
- 23.8 - ns
- 8.2 - ns
- 950 - pF
- 65 - pF
-
6
- pF
Source-Drain Diode
Symbol
VSD
IS
I SM
Parameter
Forward voltage 2
Continuous source current (body diode)
Pulsed source current (body diode)1
Test Conditions
IS= 4A, VGS=0V
VD=VG=0V , VS=1.3V
Min. Typ. Max. Units
-
- 1.5 V
-
-
4A
-
- 15 A
Notes:
1.Pulse width must be limited to avoid exceeding the maximum junction temperature of 150°C.
2.Pulse width <300us, duty cycle <2%.
9/12/2006 Rev.3.1
www.SiliconStandard.com
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