USM Datasheet, PDF (1/2 Pages) StarHope – Surface Mount Devices

Features
Surface Mount Devices
Lead free deivce
Size 3225mm/1210 mils
Surface Mount packaging for automated assembly
Agency recognition:
PPTC/USM Series
Applications
Almost anywhere there is a low voltage
power supply, up to DC30V and a load
to be protested, including:
Computer mother board, Modem.
Telecommunication equipments
Dimensions (mm)
A
1.0 ± 0.1
1.0 ± 0.1
B
D
Model
USM005
USM010
USM020
USM035
USM050
USM075
USM110
USM150
USM175
USM200
2.0 ± 0.1
C
min
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
Product dimensions (mm)
A
B
max
min
max
min
3.43
2.35
2.80
0.30
3.43
2.35
2.80
0.30
3.43
2.35
2.80
0.30
3.43
2.35
2.80
0.30
3.43
2.35
2.80
0.30
3.43
2.35
2.80
0.30
3.43
2.35
2.80
0.30
3.43
2.35
2.80
0.40
3.43
2.35
2.80
0.50
3.43
2.35
2.80
0.50
C
max
0.80
0.80
0.80
0.80
0.80
0.80
0.80
0.80
1.20
1.20
D
min
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
Environmental Specifications
Test
Conditions
Passive aging
Humidity aging
Thermal shock
85℃,1000hrs
85℃,85%℃R.H.,168hrs
85℃,to-40℃,13times
Resistance to solvent
MIL-STD-202,Method 215
Vibration
MIL-STD-202,Method 201
Ambient operating confitions:-40℃ to 85℃
Maximum surface of the device in the tripped state is 125℃
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
Terminal pad materials
Terminal pad solderability
Termination pad characteristics
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
REV.2014.05.01
01 | www.spsemi.cn