S29PL064J70BFI120 Datasheet, PDF (93/100 Pages) SPANSION – CMOS 3.0 Volt-Only, Simultaneous-Read/Write Flash Memory with Enhanced VersatileIO Control

Data Sheet
23.4
VBU056—56-Ball Fine-pitch BGA 7 x 9mm package (PL064J and PL032J)
0.05 C
(2X)
A1 CORNER
10 _{INDEX MARK}
A
D
TOP VIEW
A
D1
e
E
e
B
0.05 C
(2X)
A2
H G F ED CB A
6
NXφb
φ 0.08 M C
SD ₇
φ 0.15 M C A B
BOTTOM VIEW
0.10 C
8
7
6 ^{SE 7}
5
E1
4
3
2
1
A1 CORNER
A1
SEATING PLANE
C
0.08 C
SIDE VIEW
PACKAGE
JEDEC
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
N
φb
e
SD / SE
VBU 056
N/A
9.00 mm x 7.00 mm NOM
PACKAGE
MIN
NOM
MAX
---
---
1.00
0.17
---
---
0.62
---
0.76
9.00 BSC.
7.00 BSC.
5.60 BSC.
5.60 BSC.
8
8
56
0.35
0.40
0.45
0.80 BSC.
0.40 BSC.
A1,A8,D4,D5,E4,E5,H1,H8
NOTE
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3440\ 16-038.25 \ 01.13.05
April 18, 2013 S29PL-J_00_A16
S29PL-J
93