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| MB9AA40NB Datasheet, PDF (78/125 Pages) SPANSION – This document states the current technical specifications regarding | |||
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DataSheet
(2) Sub Clock Input Characteristics
Parameter
Symbol
Pin
name
Conditions
Input frequency
Input clock cycle
Input clock pulse
width
fCL
tCYLL
-
-
X0A,
X1A
-
-
PWH/tCYLL,
PWL/tCYLL
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Min
Value
Typ
Max Unit
Remarks
When crystal
- 32.768 - kHz oscillator is
connected
32
-
100
kHz
When using
external clock
10
-
31.25
μs
When using
external clock
45
-
55
%
When using
external clock
X0A
(3) Built-in CR Oscillation Characteristics
ï Built-in High-speed CR
Parameter Symbol Conditions
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Min
Value
Typ
Max
Unit
Remarks
TA = + 25°C
VCC ⥠2.7 V
3.96 4 4.04
Clock frequency
fCRH
TA = + 25°C
VCC < 2.7 V
3.9
4
4.1
When trimming*1
MHz
TA =
- 40°C to + 85°C
3.84
4
4.16
TA =
- 40°C to + 85°C
2.8
-
5.2
When not trimming
Frequency
stabilization time
tCRWT
-
-
-
30 μs *2
*1: In the case of using the values in CR trimming area of Flash memory at shipment for frequency/temperature
trimming.
*2: This is the time to stabilize the frequency of High-speed CR clock after setting trimming value.
This period is able to use High-speed CR clock as source clock.
ï Built-in Low-speed CR
Parameter Symbol Conditions
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Min
Value
Typ
Max
Unit
Remarks
Clock frequency
fCRL
-
50 100 150 kHz
June 10, 2015, MB9AA40NB_DS706-00038-4v0-E
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