MBM29DL16XTD-70 Datasheet, PDF (72/74 Pages) SPANSION – FLASH MEMORY CMOS 16M (2M X 8/1M X 16) BIT Dual Operation

MBM29DL16XTD/BD-70/90
s PACKAGE DIMENSIONS
48-pin plastic TSOP(1)
(FPT-48P-M19)
LEAD No.
1
INDEX
24
20.00±0.20
(.787±.008)
* 18.40±0.20
(.724±.008)
"A"
0.10(.004)
C _{2003 FUJITSU LIMITED F48029S-c-6-7}
48-pin plastic TSOP(1)
(FPT-48P-M20)
LEAD No.
1
INDEX
24
0.10(.004)
"A"
* 18.40±0.20
(.724±.008)
20.00±0.20
(.787±.008)
C _{2003 FUJITSU LIMITED F48030S-c-6-7}
72
Note 1) * : Values do not include resin protrusion.
Resin protrusion and gate protrusion are +0.15(.006)Max(each side).
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
48
Details of "A" part
0.25(.010)
0~8˚
0.60±0.15
(.024±.006)
25
* 12.00±0.20
(.472±.008)
1.10
+0.10
–0.05
.043
+.004
–.002
(Mounting
height)
0.50(.020)
0.17
+0.03
–0.08
.007
+.001
–.003
0.22±0.05
(.009±.002)
0.10±0.05
(.004±.002)
(Stand off height)
0.10(.004) M
Dimensions in mm (inches).
Note: The values in parentheses are reference values
Note 1) * : Values do not include resin protrusion.
Resin protrusion and gate protrusion are +0.15(.006)Max(each side).
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
48
Details of "A" part
0.60±0.15
(.024±.006)
0~8˚
0.25(.010)
25
0.17
+0.03
–0.08
.007
+.001
–.003
0.50(.020)
0.22±0.05
(.009±.002)
0.10(.004) M
0.10±0.05
(.004±.002)
(Stand off height)
* 12.00±0.20(.472±.008)
1.10
+0.10
–0.05
.043
+.004
–.002
(Mounting height)
Dimensions in mm (inches).
Note: The values in parentheses are reference values
(Continued)