S25FL064P Datasheet, PDF (64/67 Pages) SPANSION – 64-Mbit CMOS 3.0 Volt Flash Memory with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus

Data Sheet
19.4 FAC024 — 24-ball Ball Grid Array (6 x 8 mm) package
PACKAGE
JEDEC
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
N
Øb
e
SD/ SE
FAC024
N/A
8.00 mm x 6.00 mm NOM
PACKAGE
MIN
NOM
MAX
---
---
1.20
0.25
---
---
0.70
---
0.90
8.00 BSC.
6.00 BSC.
5.00 BSC.
3.00 BSC.
6
4
24
0.35
0.40
0.45
1.00 BSC.
0.5/0.5
NOTE
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCHL
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
J
PACKAGE OUTLINE TYPE
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
DATUM C IS THE SEATING PLANE AND IS DEFINED BY THE
CROWNS OF THE SOLDER BALLS.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
10 OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
3642 F16-038.9 \ 09.10.09
64
S25FL064P
S25FL064P_00_06 September 21, 2012