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AM41DL32X4G Datasheet, PDF (61/65 Pages) Advanced Micro Devices – 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 4 Mbit (512 K x 8-Bit/256 K x 16-Bit) Static RAM
AC CHARACTERISTICS
Address
CE1#s
CE2s
UB#s, LB#s
WE#
Data In
Data Out
PRELIMINARY
tAS
(See Note 4)
High-Z
tWC
tCW
(See Note 2)
tWR (See Note 3)
tAW
tCW (See Note 2)
tBW
tWP
(See Note 5)
tDW
tDH
Data Valid
High-Z
Notes:
1. UB#s and LB#s controlled, CIOs must be high.
2. tCW is measured from CE1#s going low to the end of write.
3. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CE1#s or WE# going high.
4. tAS is measured from the address valid to the beginning of write.
5. A write occurs during the overlap (tWP) of low CE#1 and low WE#. A write begins when CE1#s goes low and WE# goes low when
asserting UB#s or LB#s for a single byte operation or simultaneously asserting UB#s and LB#s for a double byte operation. A
write ends at the earliest transition when CE1#s goes high and WE# goes high. The tWP is measured from the beginning of write
to the end of write.
Figure 32. SRAM Write Cycle—UB#s and LB#s Control
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Am41DL32x4G
November 12, 2001