ILX550K Datasheet, PDF (9/11 Pages) Sony Corporation – 10680 pixel X 3 line CCD Linear Sensor (Color)

ILX550K
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Packages
The following points should be observed when handling and installing packages.
a) Remain within the following limits when applying static load to the package:
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter
of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
Cover glass
,
 _,,
 ,
 ^{,
 Plasticportion}
39N
29N
29N
0.9Nm
Ceramic portion
Adhesive
 ^{,

 (1)}
(2)
(3)
(4)
 ^{
 b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be}
 ^{generated and the package may fracture, etc., depending on the flatness of the ceramic portion.}
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the package to crack or dust to be generated.
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.
(5) Applying the metal a crash or a rub against the plastic portion.
Note that the preceding notes should also be observed when removing a component from a board after
it has already been soldered.
3) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded
30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering
tool, ground the controller. For the control system, use a zero cross type.
–9–