CXP87300 Datasheet, PDF (8/8 Pages) Sony Corporation – CMOS 8-bit Single Chip Microcomputer

Package Outline
Unit: mm
PIN NO. 1 INDEX
INDEX
100
1
18.7
16.3 ± 0.2
100PIN PQFP (CERAMIC)
81
80
81
80
4.5
CXP87300
100
PIN No. 1 INDEX
1
30
31
9.48
11.66
15.58 ± 0.2
51
50
51
30
50
31
0.45
SONY CODE
EIAJ CODE
JEDEC CODE
PQFP-100C-L01
AQFP100-C-0000-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
CERAMIC
GOLD PLATING
42 ALLOY
5.7g
16.0 ± 0.4
14.0 ± 0.2
100PIN PQFP (CERAMIC)
12.4
75
51
76
50
100
1
INDEX
0.8 ± 0.2
26
25
12.8 ± 0.2
SONY CODE
EIAJ CODE
JEDEC CODE
INDEX
PQFP-100C-L02
AQFP100-C-1414-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
CERAMIC
GOLD PLATING
42 ALLOY
2.2g
–8–