CXG1189UR Datasheet, PDF (4/4 Pages) Sony Corporation – High Power SPDT Switch

CXG1189UR
Package Outline
(Unit: mm)
12PIN UQFN (PLASTIC)
2.0
0.55 ± 0.05
9
10
7
6
x4
0.1 S A-B C
0.4 ± 0.1
0.6
4-R0.2
C
A
B
12
1
4
3
PIN 1 INDEX
0.26
0.18
0.4
0.07
0.25
0.05 M S A-B C
S
Solder Plating
+ 0.09
0.14 – 0.03
0.05 S
S
+ 0.09
0.25 – 0.03
TERMINAL SECTION
Note:Cutting burr of lead are 0.05mm MAX.
SONY CODE
EIAJ CODE
JEDEC CODE
UQFN-12P-01
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.01g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
-4-
Sony Corporation