CXP81952M Datasheet, PDF (27/27 Pages) Sony Corporation – CMOS 8-bit Single Chip Microcomputer

Package Outline
Unit: mm
100PIN QFP (PLASTIC)
23.9 ± 0.4
+ 0.4
20.0 – 0.1
+ 0.1
0.15 – 0.05
CXP81952M/81960M
0.65
±0.12 M
0.15
A
+ 0.35
2.75 – 0.15
0° to 15°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
QFP-100P-L01
∗QFP100-P-1420-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
SOLDER PLATING
LEAD MATERIAL
PACKAGE WEIGHT
COPPER / 42 ALLOY
1.4g
75
76
100PIN LQFP (PLASTIC)
16.0 ± 0.2
∗ 14.0 ± 0.1
51
50
100
1
0.5 ± 0.08
+ 0.08
0.18 – 0.03
0.1 ± 0.1
A
26 _(0.22)
25
+ 0.2
1.5 – 0.1
+ 0.05
0.127 – 0.02
0.1
0° to 10°
NOTE: Dimension “∗” does not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
DETAIL A
LQFP-100P-L01
∗QFP100-P-1414-A
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY/PHENOL RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
42 ALLOY
PACKAGE WEIGHT
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