CXD2931R-9 Datasheet, PDF (26/27 Pages) Sony Corporation – 1 chip GPS LSI

Package Outline
Unit: mm
CXD2931R-9
108
109
144PIN LQFP (PLASTIC)
22.0 ± 0.2
1.7 MAX
20.0 ± 0.1
73
1.4 ± 0.1
72
CXD2931R-9/GA-9
144
1 _0.5
b
0.1 ± 0.05
0˚ to 10˚
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
LQFP-144P-L01
LQFP144-P-2020
B
A
37
36
0.08 M S
S
b = 0.20 ± 0.03
0.1 S
DETAIL B
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
PALLADIUM PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
1.3 g
– 26 –