CXA3685ER Datasheet, PDF (23/23 Pages) Sony Corporation – Direct Conversion IC for Digital Satellite Broadcast Tuner

CXA3685ER
Package Outline
(Unit: mm)
36
37
A
48PIN VQFN (PLASTIC)
6.4
6.0
C
25
0.9 ± 0.1
0.6 ± 0.1
0.05 S
3.0
0.7
Thermal Die Pad
24
B
48
1
13
12
0.4
x4
0.1 S A-B C ^S
x4
0.1 S A-B C
0.05 M S A-B C
45˚
2.2
Solder Plating
NOTE:1)The dimension of ( ∗1) is apply to DiePad and the lead.
0.13 ± 0.025
+ 0.09
0.14 – 0.03
TERMINAL SECTION
SONY CODE
EIAJ CODE
JEDEC CODE
VQFN-48P-02
P-VQFN48-6.0X6.0-0.4
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.1g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18μm
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Sony Corporation