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CXP84220 Datasheet, PDF (19/19 Pages) Sony Corporation – CMOS 8-bit Single Chip Microcomputer
Package Outline
Unit: mm
64PIN SDIP (PLASTIC)
+ 0.4
57.6 – 0.1
64
33
1
32
1.778
CXP84220/84224
0° to 15°
0.5 ± 0.1
0.9 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-64P-01
SDIP064-P-0750
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
SOLDER PLATING
42 ALLOY
8.6g
– 19 –