CXA1315M Datasheet, PDF (11/11 Pages) Sony Corporation – 8-bit D/A Converter Supporting with I2C Bus

CXA1315P
16PIN DIP (PLASTIC)
+ 0.4
19.2 – 0.1
16
9
1
8
2.54
0° to 15°
CXA1315M/P
0.5 ± 0.1
1.2 ± 0.15
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-16P-01
DIP016-P-0300
Similar to MO-001-AE
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
SOLDER PLATING
COPPER ALLOY
1.0 g
16PIN DIP (PLASTIC) 300mil
19.35 ± 0.5
16
9
1
8
2.54 ± 0.254
1.016
0° to 10°
0.457 ± 0.076
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-16P-191
DIP016-P-0300-AU
MS-001-AA
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER
PACKAGE WEIGHT
1.0g
– 11 –