ESDP020604V12B1 Datasheet, PDF (3/5 Pages) Socay Electornics Co., Ltd. – ESD Array

ESD Array
ESDP020604V12B1
Temperature Specifications
Parameter
Value
Operating Temperature
-55 to +125
Storage Temperature
--55 to +125
Taping Package
Storage
Condition
Storage Temperature
Relative Humidity
Storage Time
5 to 40
<65
12 Max
Unit
°C
°C
°C
%RH
Month
Soldering Parameters
TP
TL
TS(max)
Ramp-up
TS(min)
25
Preheat
Time to peak temperature
(t 25℃ to peak)
Critical Zone
TL to TP
Ramp-down
Time
Precaution for soldering
Precaution for soldering
Note that this product will be easily damaged by rapid heating,
rapid cooling or local heating.
Do not give heat shock over 100°C in the process of soldering.
We recommend to take preheating and gradual cooling
Soldering gun procedure
Note the follows, in case of using solder gun for replacement.
1) The tip temperature must be less than 280 for the period
within 3 seconds by using soldering gun under 30W
2) The soldering gun tip shall not touch this product directly.
Soldering volume
Note that excess of soldering volume will easily get crack the
body of this product.
Reflow Condition
-Temperature Min (Ts(min))
Pre Heat -Temperature Max (Ts(max))
Pb free assembly
+150°C
+200°C
-Time (min to max) (TS)
60 -180 Seconds
Average ramp up rate ( Liquidus Temp TL)
to peak
3°C/Second Max
TS(max) to TL - Ramp-up Rate
3°C/Second Max
Reflow
- Temperature (TL) (Liquidus) +217°C
- Time (min to max) (TL)
60 -150 Seconds
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (TP)
Ramp-down Rate
260 +0/-5°C
20-40 Seconds
6°C/Second Max
Time 25°C to peak Temperature (TP)
8 minutes Max
SOCAY Electronics Co., Ltd.
Revision November 08, 2013
3/5
www.socay.com
@SOCAY Electronics Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.