USB3500 Datasheet, PDF (46/46 Pages) SMSC Corporation – Hi-Speed USB Host, Device or OTG PHY With UTMI+ Interface

Hi-Speed USB Host, Device or OTG PHY With UTMI+ Interface
Chapter 8 Package Outline
Datasheet
The USB3500 is offered in a compact 56 lead QFN package.
Figure 8.1 USB3500-ABZJ 56 Pin QFN Package Outline, 8 x 8 x 0.9 mm Body (Lead Free)
Table 8.1 56 Terminal QFN Package Parameters
MIN
NOMINAL
MAX
A
0.70
~
1.00
A1
0
0.02
0.05
A2
0.60
~
0.90
A3
0.20 REF
D
7.85
8.00
8.15
D1
7.55
~
7.95
D2
2.25
4.5
6.80
E
7.85
8.00
8.15
E1
7.55
~
7.95
E2
2.25
4.5
6.80
L
0.30
~
0.55
e
0.50 Basic
b
0.18
~
0.30
REMARKS
Overall Package Height
Standoff
Mold Thickness
Copper Lead-frame Substrate
X Overall Size
X Mold Cap Size
X exposed Pad Size
Y Overall Size
Y Mold Cap Size
Y exposed Pad Size
Terminal Length
Terminal Pitch
Terminal Width
Notes:
1. Controlling Unit: millimeter.
2. Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the
terminal tip. Tolerance on the true position of the leads is ± 0.05 mm at maximum material
conditions (MMC).
3. Details of terminal #1 identifier are optional but must be located within the zone indicated.
Revision 1.0 (04-04-05)
46
DATASHEET
SMSC USB3500