TMC20073 Datasheet, PDF (1/4 Pages) SMSC Corporation – CIRCLINK COMMUNICATIONS CONTROLLER LSI

TMC20073
CircLink^TM Communications
Controller LSI
Product Features
■ 3.3V (3.0 to 3.6V) Power Supply Voltage (Vdd)
■ 128 Pin TQFP Package (14x14, 0.4 pitch)
■ Supports 8/16-Bit Data Bus (Selectable)
■ Full 1K On-Chip Dual-Port Buffer RAM
■ Supports Sequential I/O Mapped Access to Internal
RAM Buffer
■ Supports up to 31 Nodes
■ Low Power CMOS, 3.3V Operation with 5V Tolerance
Data Brief
■ Cabling Options
— Fiber Optics, RS485 Twisted Pair
■ High Speed: Up to 5 Mbps
■ Include 3 Port HUB
■ Can operate with or without CPU
— With CPU: Support interface to multiple CPU’s
– Intel (80XX) and Motorola (68XXX)
— Without CPU: Support general purpose I/O ports
– 16 bit input and 16 bit output
■ Support multi-topology
— Bus, Star and Mixed type
■ Temperature Range from -20° to 85°
Micro-Controller bus nMUX nRWM W16 nSWAP
Others
Clock
nNSTCOUT FLASHO
Register Access
Control Circuit
Mode Setting
Interrupt Status
Interrupt Mask
EC Command
Receive Mode(#01-#31)
Receive Flag(#01-#31)
Clock Master SID
Net. Standard Time
Alarm Setting
Receive SID
Search SID
MAX ID Setting (MAXID)
Node ID Setting (NID)
Page Size Setting (PS)
Data Rate Setting
PIN-INFO
ERR-INFO
Memory Access Mediation Circuit
Address pointer
Page Register
Address Register
Diag. Register
Data Register H
Data Register L
Data Latch
TENT-ID Register
CONFIG Register
SETUP Registers
Address
Multiplexer
Address Pointer
Buffer Memory
512B
512B
Improved ARCNET Protocol
Micro Sequencer
Working Registers
Data Latch Shift Register
RECON Timer
TX Signal
Generator
RX Synchro-
nous circuit
3Port HUB Circuit
CMI Encode CMI Decode
Reset Circuit
OSC
CMI Synchro
MAXID NID PS CKP nSTALONE nDIAG nHUBON nCMIBYP TXEN2 TXEN TXD RXIN2 RXIN
Figure 1 Internal Block Diagram of LSI
SMSC TMC20073
PRODUCT PREVIEW
Revision 1.3 (02-11-04)