8SOIC Datasheet, PDF (1/1 Pages) SMSC Corporation – 8 PIN SOIC PACKAGE OUTLINE

8 PIN SOIC/SOIN PACKAGE OUTLINE
3
D
e
SEE DETAIL "A"
8
H
3 E1
E
0.25
GAUGE PLANE
12
5
INDEX AREA
(D/2 X E1/2)
8X b 2 4
TOP VIEW
4
c
END VIEW
L
L1
0°-8°
DETAIL "A" (SCALE: 3/1)
C
SEATING PLANE
ccc C
SIDE VIEW
Min
A
1.35
A1
0.10
A2
1.25
D
4.80
E
5.80
E1
3.80
L
0.40
L1
b
0.31
c
0.17
e
ccc
-
A2 _A
A1
Nominal
-
-
-
4.90
6.00
3.90
-
1.05 REF
-
-
1.27 BSC
-
3-D VIEW
Max
Remarks
1.75
Overall Package Height
0.25
Standoff
1.65
Package Body Thickness
5.00
"X" Body Size
6.20
Lead Span
4.00
"Y" Body Size
0.90
Lead Foot Length
Lead Length
0.51
Lead Width
0.25
Lead Thickness
Lead Pitch
0.10
Coplanarity
Notes:
1. All dimensions are in millimeters.
2. True position spread tolerance of each lead is ±0.125mm at maximum material condition.
3. Dimension "D" does not include mold flash, protrusions or gate burrs. Maximum mold flash, protrusions or gate
burrs is 0.15mm per end. Dimension "E1" does not include inter-lead flash or protrusion. Maximum inter-lead
flash or protrusion is 0.25mm per side. Dimensions "D" & "E1" are determined at the datum plane "H".
4. Dimensions "b" and "c" apply to the flat section of the lead between 0.10 to 0.25mm from the lead tip.
5. Details of pin 1 identifier are optional, but must be located within the index area indicated.
6. Provided for reference only - contact your SMSC Regional Sales Office for latest information.
80 Arkay Drive
Hauppauge, NY 11788
[phone]
FAX [phone]
Rev. 8/23/05