MBRF3060CTP Datasheet, PDF (5/7 Pages) Sangdest Microelectronic (Nanjing) Co., Ltd – SCHOTTKY RECTIFIER

SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N0125, Rev. A
Electrical Characteristics:
Characteristics
Max. Forward Voltage Drop
(per leg)*
Max. Reverse Current (per
leg)*
Max. Junction Capacitance
(per leg)
Max. Voltage Rate of Change
RSM Isolation Voltage
(t = 1.0 second, R. H. < =30%,
T_A = 25 °C)
* Pulse Width < 300µs, Duty Cycle <2%
Symbol
V_F1
V_F2
I_R1
I_R2
C_T
dv/dt
V_ISO
Condition
@ 15A, Pulse, T_J = 25 °C
@ 15 A, Pulse, T_J = 125 °C
@V_R = rated VR
T_J = 25 °C
@V_R = rated VR
T_J = 125 °C
@V_R = 5V, T_C = 25 °C
f_SIG = 1MHz
-
Clip mounting, the epoxy body
away from the heatsink edge by
more than 0.110" along the lead
direction.
Clip mounting, the epoxy body is
inside the heatsink.
Screw mounting, the epoxy body
is inside the heatsink.
MBRF3060CTP
Green Products
Max.
0.77
0.67
1.0
100
700
10,000
4500
3500
1500
Units
V
V
mA
mA
pF
V/µs
V
Thermal-Mechanical Specifications:
Characteristics
Max. Junction Temperature
Max. Storage Temperature
Maximum Thermal
Resistance Junction to Case
Maximum Thermal
Resistance, Case to Heat
Sink
Approximate Weight
Case Style
Symbol
T_J
T_stg
R_θJC
Condition
-
-
DC operation
R_θJA DC operation
wt
-
ITO-220AB
Specification
-55 to +150
-55 to +150
3.0
Units
°C
°C
°C/W
60
°C/W
2
g
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 •
• FAX [phone] • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •