MBRF3060CT Datasheet, PDF (5/7 Pages) Tiger Electronic Co.,Ltd – TO-220F Plastic-Encapsulate Diodes

SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N0177, Rev. A
MBRF3060CT
Green Products
Electrical Characteristics:
Characteristics
Max. Forward Voltage Drop
(per leg)*
Max. Reverse Current (per
leg)*
Max. Junction Capacitance
(per leg)
Typical Series Inductance
(per leg)
Max. Voltage Rate of Change
RSM Isolation Voltage
(t = 1.0 second, R. H. < =30%,
T_A = 25 °C)
* Pulse Width < 300µs, Duty Cycle <2%
Symbol
V_F1
V_F2
I_R1
I_R2
C_T
L_S
dv/dt
V_ISO
Condition
@ 15A, Pulse, T_J = 25 °C
@ 15 A, Pulse, T_J = 125 °C
@V_R = rated VR
T_J = 25 °C
@V_R = rated VR
T_J = 125 °C
@V_R = 5V, T_C = 25 °C
f_SIG = 1MHz
Measured lead to lead 5 mm from
package body
-
Clip mounting, the epoxy body
away from the heatsink edge by
more than 0.110" along the lead
direction.
Clip mounting, the epoxy body is
inside the heatsink.
Screw mounting, the epoxy body
is inside the heatsink.
Max.
0.70
0.67
1.0
100
700
8.0
10,000
4500
3500
1500
Units
V
V
mA
mA
pF
nH
V/µs
V
Thermal-Mechanical Specifications:
Characteristics
Max. Junction Temperature
Max. Storage Temperature
Maximum Thermal
Resistance Junction to Case
Maximum Thermal
Resistance, Case to Heat
Sink
Approximate Weight
Case Style
Symbol
T_J
T_stg
R_θJC
Condition
-
-
DC operation
R_θJA DC operation
wt
-
ITO-220AB
Specification
-55 to +150
-55 to +150
3.0
Units
°C
°C
°C/W
60
°C/W
2
g
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