63CPQ080 Datasheet, PDF (3/5 Pages) Sangdest Microelectronic (Nanjing) Co., Ltd – High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance

SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N0208, Rev. A
63CPQ080
63CPQ100
Green Products
Electrical Characteristics:
Characteristics
Forward Voltage Drop
(per leg) *
Reverse Current (per leg) *
Junction Capacitance
(per leg)
Typical Series Inductance
(per leg)
Voltage Rated of Change
* Pulse Width < 300µs, Duty Cycle <2%
Symbol
V_F1
V_F2
I_R1
I_R2
C_J
L_S
dv/dt
Condition
@ 30A, Pulse, T_J = 25 °C
@ 30A, Pulse, T_J = 125 °C
@V_R = rated VR
T_J = 25 °C
@V_R = rated VR
T_J = 125 °C
@V_R = 5V, T_C = 25 °C
f_SIG = 1MHz
Measured lead to lead 5 mm from
package body
-
Max.
0.80
0.75
0.3
25.0
1300
7.5
10,000
Units
V
V
mA
mA
pF
nH
V/μs
Thermal-Mechanical Specifications:
Characteristics
Symbol
Junction Temperature
T_J
Storage Temperature
T_stg
Maximum Thermal
R_θJC
Resistance Junction to Case
(per leg)
Maximum Thermal
Resistance, Case to Heat
R_θCS
Sink
Approximate Weight
wt
Case Style
Condition
-
-
DC operation
Mounting surface, smooth and
greased
-
TO-247AD
Specification
-55 to +150
-55 to +150
0.8(per leg)
0.4(per device)
0.25
Units
°C
°C
°C/W
°C/W
6.7
g
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