SMP1005-01WTG Datasheet, PDF (2/5 Pages) Sangdest Microelectronic (Nanjing) Co., Ltd – Industries smallest ESD footprint available

Technical Data
Data Sheet N1769 Rev.-
Ordering Information:
Device
SMP1005-01WTG
Package
0201 Flipship
SMP1005-01WTG
Green Products
Marking
●
Min. Order Qty.
10000
Absolute Maximum Ratings:
Parameter
Symbol
Value
Unit
Peak Pulse Current (tp=8/20μs)
IPP
10.0
A
Operating Temperature
TOP
-40 to + 125
°C
Storage Temperature
TSTOR
-60 to + 150
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only
rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not
implied.
Thermal Information:
Parameter
Storage Temperature Range
Maximum Junction Temperature
Maximum Lead Temperature
(Soldering 20-40s)
Value
Unit
-55 to + 150
°C
150
°C
260
°C
Electrical Characteristics: (T_OP=25°C)
Characteristics
Reverse Stand-Off Voltage
Breakdown Voltage
Reverse Leakage Current
Clamping Voltage¹
ESD With stand Voltage¹
Dynamic Resistance
Junction Capacitance¹
Symbol
V_RWM
V_BR
I_LEAK
V_C
V_ESD
R_DYN
C_D
Condition
-
I_R = 1mA
V_R =5V with 1pin at GND
I_PP = 1A, tp=8/20μs, Fwd
I_PP = 2A, tp=8/20μs, Fwd
I_PP = 10A, tp=8/20μs, Fwd
IEC61000-4-2
(Contact Discharge)
IEC61000-4-2
(Air Discharge)
(V_C2-V_C1)/(I_PP2-I_PP1)
Reverse Bias=0V
Reverse Bias=2.5V
Note: 1. Parameter is guaranteed by design and/or device characterization.
Min.
-
-
-
-
-
-
±30
Typ.
-
8.5
0.1
9.3
10.0
15.6
-
Max.
6.0
9.5
0.5
-
-
-
Units
V
V
μA
V
V
kV
±30 -
-
kV
- 0.28 -
Ω
-
30
-
pF
-
23
-
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