409DMQ Datasheet, PDF (2/4 Pages) Sangdest Microelectronic (Nanjing) Co., Ltd – All SMC parts are traceable to the wafer lot

SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N1502, Rev. -
Maximum Ratings:
409DMQ SERIES
Green Products
Characteristics
Peak Inverse Voltage
Max. Average Forward
Current
Max. Peak One Cycle Non-
Repetitive Surge Current
(per leg)
Electrical Characteristics:
Symbol
V_RWM
Condition
-
I_F(AV)
50% duty cycle @T_C =105°C,
rectangular wave form
I_FSM 8.3 ms, half Sine pulse
Max.
Units
135 409CMQ135
V
150 409CMQ150
200
per leg
A
400
per device
2760
A
Characteristics
Max. Forward Voltage Drop
(per leg) *
Max. Reverse Current (per
leg) *
Max. Junction Capacitance
(per leg)
Typical Series Inductance
(per leg)
Isolation Voltage
Max. Voltage Rate of Change
* Pulse Width < 300µs, Duty Cycle <2%
Symbol
V_F1
V_F2
I_R1
I_R2
C_T
L_S
V_ISO
dv/dt
Condition
@ 200A, Pulse, T_J = 25 °C
@ 400A, Pulse, T_J = 25 °C
@ 200A, Pulse, T_J = 125 °C
@ 400A, Pulse, T_J = 125 °C
@V_R = rated VR T_J = 25 °C
@V_R = rated VR T_J = 125 °C
@V_R = 5V, T_C = 25 °C
f_SIG = 1MHz
Measured lead to lead 5 mm
from package body
Tracer to 1500V, measuring
whether conducting base
plate and the center column
-
Max.
1.03
1.21
0.72
0.83
6
85
6000
5.0
1500
10,000
Units
V
V
mA
mA
pF
nH
V
V/µs
Thermal-Mechanical Specifications:
Characteristics
Max. Junction Temperature
Max. Storage Temperature
Maximum Thermal
Resistance Junction to Case
(per leg)
Maximum Thermal
Resistance Junction to Case
(per package)
Typical Thermal Resistance,
case to Heat Sink
Mounting Torque
Approximate Weight
Case Style
Symbol
T_J
T_stg
Condition
-
-
R_θJC
DC operation
Specification
-55 to +150
-55 to +150
0.40
Units
°C
°C
°C/W
R_θJC
DC operation
0.20
°C/W
R_θcs
Mounting surface, smooth
and greased
0.10
°C/W
Mounting 24(min)
TM
-
Torque
Terminal
35(max)
35(min)
Kg-cm
Torque 46(max)
wt
-
79
g
PRM4 Isolated
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