403CMQ_SERIES Datasheet, PDF (2/4 Pages) Sangdest Microelectronic (Nanjing) Co., Ltd – Center tap module

SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N0990, Rev. E
Maximum Ratings:
Characteristics
Peak Inverse Voltage
Average Forward Current
Peak One Cycle Non-
Repetitive Surge Current
(per leg)
Non-Repetitive Avalanche
Energy(peg leg)
Repetitive Avalanche
Current(peg leg)
Symbol
V_RWM
Condition
-
I_F(AV)
50% duty cycle @T_C =85°C,
rectangular wave form
I_FSM 8.3 ms, half Sine pulse
E_AS T_J=25℃,I_AS=1A,L=30mH
I_AR Current decaying linearly to
zero in 1 μsec Frequency
limited by T_J max. V_A=1.5×V_R
typical
403CMQ SERIES
Max.
80 403CMQ080/R
100 403CMQ100/R
200
per leg
400
per device
Units
V
A
3960
A
15
mJ
1
A
Electrical Characteristics:
Characteristics
Forward Voltage Drop
(per leg) *
Reverse Current (per leg) *
Junction Capacitance
(per leg)
Typical Series Inductance
(per leg)
Max. Voltage Rate of Change
* Pulse Width < 300µs, Duty Cycle <2%
Symbol
V_F1
V_F2
I_R1
I_R2
C_T
L_S
dv/dt
Condition
@ 200A, Pulse, T_J = 25 °C
@ 400A, Pulse, T_J = 25 °C
@ 200A, Pulse, T_J = 125 °C
@ 400A, Pulse, T_J = 125 °C
@V_R = rated VR T_J = 25 °C
@V_R = rated VR T_J = 125 °C
@V_R = 5V, T_C = 25 °C
f_SIG = 1MHz
Measured lead to lead 5 mm
from package body
-
Max.
0.83
0.97
0.69
0.82
6
140
5500
5.0
10,000
Units
V
V
mA
mA
pF
nH
V/μs
Thermal-Mechanical Specifications:
Characteristics
Symbol
Junction Temperature
T_J
Storage Temperature
T_stg
Maximum Thermal
Resistance Junction to Case
R_θJC
(per leg)
Maximum Thermal
Resistance Junction to Case
R_θJC
(per package)
Typical Thermal Resistance,
R_θcs
case to Heat Sink
Mounting Torque
TM
Approximate Weight
wt
Case Style
Condition
-
-
DC operation
Specification
-55 to +175
-55 to +175
0.40
DC operation
0.20
Mounting surface, smooth
0.10
and greased
Mounting 24(min)
-
Torque 35(max)
Terminal 35(min)
Torque 46(max)
-
79
PRM4 Isolated
Units
°C
°C
°C/W
°C/W
°C/W
Kg-cm
g
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