SMP3022-01ETG Datasheet, PDF (1/5 Pages) Sangdest Microelectronic (Nanjing) Co., Ltd – MIPI Camera and Display

SMP3022-01ETG
Technical Data
Data Sheet N1741 Rev.-
Green Products
Description
The SMP3022 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide
protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2
international standard ( ± 20kV contact discharge) without performance degradation. The back-to-back
configuration provides symmetrical ESD protection for data lines when AC signals are present and the low loading
capacitance makes it ideal for protecting high speed data lines such as HDMI, USB2.0, USB3.0 and eSATA.
Features
• ESD protection in accordance with:
IEC 61000-4-2 (ESD) ±30kV (air), ±20kV (contact)
IEC 61000-4-5 (lightning) 3A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
• Low capacitance of 0.35pF @ V_R=0V (TYP)
• Low leakage current of 100nA at 5.3V(MAX)
• Extremely low dynamic resistance (0.7Ω TYP)
Applications
• USB 3.0/USB 2.0/MHL
• MIPI Camera and Display
• HDMI 2.0, DisplayPort 1.3, eSATA
• Set Top Boxes, Game Consoles
• Smart Phones
• External Storage
• Ultrabooks, Notebooks
• Tablets, eReaders
• High Speed Serial Interfaces
Pinout
Functional Block Diagram
• China - Germany - Korea - Singapore - United States •
• http://www.smc-diodes.com - sales@ smc-diodes.com •