120NQ600-1 Datasheet, PDF (1/4 Pages) Sangdest Microelectronic (Nanjing) Co., Ltd – Reduced RFI and EMI

SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N1523, Rev. -
120NQ600-1
Green Products
120NQ600-1 Ultrafast Recovery Modules
Features:
• Reduced RFI and EMI
• Reduced Snubbing
• Extensive Characterization of Recovery Parameters
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request
Mechanical Dimensions: In Inches / mm
PRM1-1(HALF PAK Module)
MARKING,MOLDING RESIN
Marking for 120NQ600-1, 1^st row SS YYWWL, 2^nd row 120NQ600-1
Where YY is the manufacture year
WW is the manufacture week code
L is the wafer’s Lot Number
Molding resin
Epoxy resin UL:94V-0
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 •
• FAX [phone] • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •