SKY65249-11 Datasheet, PDF (9/10 Pages) Skyworks Solutions Inc. – WLAN 802.11b, g, n Intera Front-End Module

DATA SHEET • SKY65249-11
Package Dimensions
Solder Mask Opening
See Detail C
Pin 20
Pin 1 Indicator
See Detail B
Pin 1
Mold
MCM
Substrate
A
20X SMT PAD
Pin 1 Indicator
See Detail B
4
4
0.90 ± 0.1
0.45 ± 0.075
0.1
0.25 ± 0.025
0.35 ± 0.03
Detail A
Stencil Aperture (Top View)
0.2 x 0.2 mm
4.3 mm
Pin 20
Pin 1
0.5 mm Typ.
4.3 mm
20X 0.7 mm
20X 0.3 mm
0.88 mm
Stencil aperature size for
center ground pad should be
80% to 100% (by area) of the
solder mask opening
Package Outline
Exposed Center Pad
0.875
0.875
Solder Mask Edges
Detail B
0.875
0.875
Solder Mask Edges
Detail C
Solder Mask Opening (Top View)
0.2 x 0.2 mm
4.4 mm
Pin 20
Pin 1
4.4 mm
0.5 mm Typ.
1.88 mm
20X 0.8 mm
20X 0.4 mm
0.46 mm Typ.
Footprint (Top View)
4.3 mm
Pin 20
Pin 1
0.5 mm Typ.
4.3 mm
20X 0.7 mm
20X 0.3 mm
0.25 mm
0.25 mm Typ.
0.6 mm
Package Outline
0.35 mm
Thermal Via Array under PA areas. 0.3 mm on 0.6 mm
pitch. Additional vias will improve thermal performance.
Note: Thermal vias should be tented and filled with
solder mask. 30–35 µm Cu plating is recommended.
Stencil aperature size for
center ground pad should be
80% to 100% (by area) of the
solder mask opening
1.88 mm
Package Outline
Exposed Center Pad
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
200657 Rev. G • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • September 2, 2008
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