SKY65206-13_09 Datasheet, PDF (9/12 Pages) Skyworks Solutions Inc. – WLAN 802.11b/g Intera Front-End Module

DATA SHEET • SKY65206-13 FRONT-END MODULE
Pin 24
Pin 1
24X 0.5
24X 0.75
7.3
1.0 Typ.
0.85 Sq. Typ.
Pin 24
Pin 1
0.6
7.3
1.63
Component
Outline
8.3
Stencil aperture 80-100% of
module/pkg solder mask area
1.05 Typ.
0.53 Typ.
8.3
Stencil Aperture
Top View
24X SMT Pad
0.2 A B C
13X 0.5
13X 0.75
Pin 24
Pin 1
Stencil aperture 80-100% of
module/pkg solder mask area
24X 0.6
24X 0.85
1.0 Typ.
2.53
7.4
1.0 Typ.
Thermal Via Array,
Ø0.3 mm on 0.6 mm pitch
will improve thermal performance.
NOTE: thermal vias should
be tented and filled with solder
mask, 30-35 mm Cu plating
recommended.
All dimensions are in millimeters
1.55
Metallization
Top View
0.25 Typ.
Component
Outline
3.05
8.4
Solder Mask Opening
Top View
Figure 13. Board Layout Footprint for the SKY65206-13 4 x 4 mm MCM
24X SMT Pad
0.2 A B C
S1573
Pin 1 Indicator
Skyworks
Part No.
SKY65206-13
Vendor
Assembly
Number
Date Code:
YY = Calendar Year
WW = Week
CC = Country
Figure 14. Typical Case Markings
(Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
200102I • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • July 10, 2009
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