SKY65227-11 Datasheet, PDF (8/9 Pages) Skyworks Solutions Inc. – WLAN 802.11n Single Band 2.4 GHz MIMO Intera™ Front-End Module

DATA SHEET • SKY65227-11
Recommended Footprint
Pin 47
10.34 mm
0.425 mm
24X 0.5 mm _{24X 0.75 mm}
Pin 1
0.85 mm Typ.
0.35 mm
0.175 mm
Typ.
1.4 mm
CL
1.4 mm
0.7 mm
14.34 mm
CL
Thermal Via Array
0.3 mm on 0.7 mm Pitch 0.35mm
Additional Vias in Common Ground
Pad Will Improve Thermal Performance
0.7 mm
0.25 mm
Typ.
Thermal vias should be tented and filled with solder mask 30–35 µm
copper plating recommended.
Solder Mask
Pin 48
0.20 X 45
Pin 1
6X 2.1 mm
6X 5 mm
0.425 mm
10.44 mm
48X 0.6 mm
0.425 mm
48X 0.85 mm
0.85 mm Typ.
6X 0.725 mm
CL
14.44 mm
2.2 mm Typ.
2X 1.525 mm
2X 1.875 mm
CL
2 mm Typ.
8X 2.3 mm 2X 4.075 mm
Package Outline
Stencil Pattern
0.20 X 45 mm
10.34 mm
48X 0.5 mm
0.425 mm
6X 5 mm
6X 2.1 mm
48X 0.75 mm
0.85 mm Typ.
0.425 mm
CL
14.34 mm
Stencil Aperture
Size of 80–100%
of the Module/Pkg.
Solder Mask Openings
CL
8X 2.3 mm
Package
Outline
2X 2.975 mm
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
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May 7, 2007 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200553 Rev. D