SKY65124 Datasheet, PDF (7/12 Pages) Skyworks Solutions Inc. – 1930–1990 MHz High Linearity 2 W Power Amplifier

preliminary Data Sheet • SKY65124
Pin Assignments
Pin
Pin Name
Description
1
GND
Low inductance ground connection
2
GND
Low inductance ground connection
3
GND
Low inductance ground connection
4
V_{C_BIAS} Bias voltage
5
N/C
No connect
6
V_REF1
Bias reference voltage 1
7
V_REF2
Bias reference voltage 2
8
GND
Low inductance ground connection
9
RF_OUT RF output
10
GND
Low inductance ground connection
11
V_CC2
Stage 2 collector voltage
12
N/C
No connect
13
V_CC1
Stage 1 collector voltage
14
N/C
No connect
15
N/C
No connect
16
RF_IN RF input
17
GND
Low inductance ground connection
18
N/C
No connect
19
GND
Low inductance ground connection
20
GND
Low inductance ground connection
Center attachment pad must have a low inductance and low thermal resistance connection to
the customer’s printed circuit board ground plane.
Evaluation Board Description
The Skyworks SKY65124 Evaluation Board is used to test the
performance of the SKY65124 power amplifier module. The
following design considerations are general in nature and must
be followed regardless of final use or configuration.
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65124 power amplifier module has
special electrical and thermal grounding requirements. This
pad is the main thermal conduit for heat dissipation. Since
the circuit board acts as the heat sink, it must shunt as much
heat as possible from the amplifiers. As such, design the con-
nection to the ground pad to dissipate the maximum wattage
produced to the circuit. Multiple vias to the grounding layer are
required.
Evaluation Board
RF_In
5V
GND
5V
5V
GND
SKYWORKS 2006
VC_BIAS
GND
J3
VREF1
VREF2
GND
S/N
RFIN
U1
C13 C13 ^C1
U1
R1
C2 C2
R1
C3
R2
C3 _J2 R2
J2
J1
J1
R3
R3
C4
R4
R4
C5
GND
VCC_DET
VDET
C7 C6
R5
C9
C10
C11
RF OUT
C8 C8
C12
C12
J4
VCC1
VCC2
TW16-D190-
GND
N/C
N/C
5V
5V
RF_Out
Evaluation Board Test Procedure
Step 1. Connect RF test equipment to amplifier input/output
SMA connectors.
Step 2. Connect DC ground.
Step 3. Connect all V_CC, V_REG and V_{C_BIAS} lines to 5 V supply.
Verify the I_CCQ current is approximately 550 mA.
Step 4. Apply RF signal data -10 dBm level and observe that the
output level is approximately 14 dBm or the gain of the
device is approximately 24 dB.
NOTE: It is important that the V_CC1 and V_CC2 voltage source be
adjusted such that 5 V is measured at the board. The
high collector currents will drop the collector voltage
significantly if long leads are used. Adjust the bias
voltage to compensate.
Recommended Solder Reflow Profiles
Refer to the “Recommended Solder Reflow Profile”
Application Note.
Tape and Reel Information
Refer to the “Discrete Devices and IC Switch/Attenuators
Tape and Reel Package Orientation” Application Note.
NOTE: J unction temperature (T_J) of the device increases with a
poor connection to the slug and ground. This reduces the
lifetime of the device.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
200996 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • April 6, 2009
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