SKY12239-11 Datasheet, PDF (7/10 Pages) Skyworks Solutions Inc. – High IIP3 10 MHz to 1.5 GHz Voltage-Controlled Variable Attenuator

DATA SHEET • SKY12239-11: VOLTAGE-CONTROLLED VARIABLE ATTENUATOR
Package Dimensions
The PCB layout footprint for the SKY12239-11 is shown in
Figure 12. Typical part markings are shown in Figure 13.
Package dimensions are shown in Figure 14, and tape and reel
dimensions are provided in Figure 15.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it
is baked and vacuum packed before shipping. Instructions on
the shipping container label regarding exposure to moisture
after the container seal is broken must be followed. Otherwise,
problems related to moisture absorption may occur when the
part is subjected to high temperature during solder assembly.
The SKY12239-11 is rated to Moisture Sensitivity Level 3
(MSL3) at 260 C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application
Note, PCB Design & SMT Assembly/Rework Guidelines for
MCM-L Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Pin 6
Pin 1 Indicator
0.40 X 0.40
Stencil aperture size of
80 to 100% of the module/package
solder mask openings
Pin 1
2X 1.8 mm
4.1 mm
0.7 mm Pitch
4.1 mm
6X 0.65 mm
Pin 6
Pin 1 Indicator
0.40 X 0.40
Thermal via array
Ø0.3 mm on 0.6 mm pitch
improves thermal performance
Pin 1
Package Outline
6X 0.4 mm
2X 1.8 mm
Stencil Aperture
(Top View)
4.1 mm
Pin 6
0.7 mm Pitch
4.1 mm
0.25 mm Typ
6X 0.65 mm
Opening size of
60 to 100% of the exposed
center opening shown
Pin 1
2X 1.9 mm
4.2 mm
0.7 mm Pitch
4.2 mm
6X 0.75 mm
Package Outline
6X 0.4 mm
Package Outline
6X 0.5 mm
2X 1.9 mm
Metallization
(Top View)
Solder Mask Opening
(Top View)
Notes:
1. Thermal vias should be resin filled and capped in accordance with
IPC-4761 type VII vias.
2. Recommended Cu thickness is 30 to 35 µm.
Figure 12. SKY12239-11 PCB Layout Footprint
203556-010
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
203556B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 9, 2017
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