SKY77171 Datasheet, PDF (6/9 Pages) Skyworks Solutions Inc. – AutoSmart™ Power Amplifier Module for WCDMA (1920-1980 MHz)

SKY77171 • PRELIMINARY DATA SHEET
PA MODULE FOR WCDMA (1920-1980 MHZ)
0.7
0.4
2.5
0.85 TYP
1.4
4.4
STENCIL APERTURE
TOP VIEW
APPROACH 1
0.7
0.4
0.85 TYP
0.7
0.65
0.4
0.9
Component
Outline
0.85 TYP
0.2
4.4
STENCIL APERTURE
TOP VIEW
APPRAOCH 2
0.8
0.5
0.6
3.5
0.85 TYP
0.25
4.4
METALLIZATION
TOP VIEW
All dimensions are in millimeters.
Thermal Via Array
Ø0.3 mm on 0.6 mm Pitch.
Additional Vias will improve
thermal performance.
NOTE: Thermal vias should
be tented and filled with
solder mask, 30–35 µm Cu
plating recommended.
2
4.5
SOLDER MASK OPENING
TOP VIEW
200014_005
Figure 5. Phone PCB Layout for 4 x 4 mm, 10-Pad Package – SKY77171
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
6
October 14, 2005 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200014P2