SKY73120-11 Datasheet, PDF (6/9 Pages) Skyworks Solutions Inc. – 890-960 MHz Voltage Controlled Oscillator

DATA SHEET • SKY73120-11 VCO
6.3
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
9X 1
6.3
6X 0.2
6X 0.2
9X 1
Stencil Aperture
Top View
Component Outline
6.3
2X 2.45
7X 1.8
Pin 28
Pin 1
4X 0.35
6.4
0.7
Pitch
Typ
0.5
0.4
0.15
0.05 ^0.05
Stencil and
Metallization
Soldermask Opening
0.8 0.9
Component Outline
SMT Pad Detail
Scale: 2X
8X This Rotation
8X Rotated 180o
6X Rotated 90o CW
6X Rotated 90o CCW
6.4
3.7
1.85
2X 2.75
7X 1.8
6.3
4X 0.35
1.85
3.7
Solder Mask Opening
Top View
Component Outline
0.3 Typ
Metallization
Top View
Component Outline
Thermal Via Array.
∅0.3 mm on 0.6 mm pitch.
Additional vias in common ground
pad will improve thermal performance
NOTE: thermal vias should be tented
and filled with solder mask, 30-35 μm
Cu plating recommended.
Note:The cross-hatched area represents the merger of the center
ground pad +20 individual I/O ground pads. All I/O ground
pads should have at least one via connected to internal ground
planes for optimum electrical performance.
All measurements are in millimeters
Figure 5. PCB Layout Footprint for the SKY73120-11 6 x 6 MCM
S1197
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
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December 4, 2008 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 200777D