SKY73010 Datasheet, PDF (2/8 Pages) Skyworks Solutions Inc. – 300 - 2500 MHz Direct Quadrature Modulator

DATA SHEET • SKY73010
Table 1. SKY73010 Signal Descriptions
Pin #
Name
Description
1
GND
Ground
2
GND
Ground
3
GND
Ground
4
LO
LO input
5
GND
Ground
6
VCC
+5 VDC supply
7
PD
Power down
8
RF
Ground
Pin #
Name
9
GND
10
VCC
11
GND
12
GND
13
QSIG
14
ISIG
15
IREF
16
QREF
Description
Ground
+5 VDC supply
Ground
Ground
Q input
I input
I reference
Q reference
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration.
1. Paths to ground should be made as short as possible.
2. The downset paddle of the SKY73010 direct quadrature
modulator has special electrical and thermal grounding
requirements. This pad is the main thermal conduit for heat
dissipation. Since the circuit board acts as the heat sink, it
must shunt as much heat as possible from the device. As
such, design the connection to the ground pad to dissipate the
maximum wattage produced to the circuit board. Multiple vias
to the grounding layer are required.
3. Two external output bypass capacitors are required on the
VCC pin. The values of these capacitors change with respect
to the desired RF frequency. One capacitor should be used for
low frequency bypassing and the other capacitor for high
frequency bypassing. Special attention should be given so
that the smaller value capacitor does not go into self-
resonance at the desired RF frequency.
Testing Procedure
The following In-Phase and Quadrature (I/Q) input settings were
used to measure the CDMA Adjacent Channel Power Reduction
(ACPR):
• Pilot Channel Active
• Sync Channel Active
• Paging Channel Active
• Six Traffic Channels Active
• 32x oversampling
• Equifilter
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY73010 is rated to Moisture Sensitivity Level 3 (MSL3) at
260 °C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design & SMT Assembly/Rework Guidelines for RFLGA
Packages, document number 103147.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel, document number 101568.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY73010 are provided in
Table 2. The recommended operating conditions are specified in
Table 3 and electrical specifications are provided in Table 4.
Typical performance characteristics are shown in Figures 3
through 7. Figure 8 provides a typical evaluation board schematic.
Package dimensions for the 16-pin RFLGA are shown in Figure 9,
and tape and reel dimensions are shown in Figure 10.
Electrostatic Discharge (ESD) Sensitivity
The SKY73010 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper ESD
precautions.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
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October 21, 2004 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 103127C