SKY73100-11_09 Datasheet, PDF (18/21 Pages) Skyworks Solutions Inc. – 865-960 MHz High Performance VCO/Synthesizer

DATA SHEET • SKY73100-11 VCO/SYNTHESIZER
Pin 1
0.5 Typ
12.4
1.0 Pitch
Typ
1.1
0.95
9.4
2X 0.2
0.075
0.075
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
12X 0.1375
Stencil and
Metallization
Soldermask Opening
SMT Pad Detail
Scale: 2X
1 X This Rotation
1X Rotated 180^o
0.8 0.95
Component Outline
36X 1.4
24X 0.28
0.65
0.5
0.075
0.2
0.075
Component Outline
24X 0.27
12X 0.1375
36X 0.9
Stencil Aperture
Top View
0.075
1.1
0.95
0.075
0.95 0.8
Stencil and
Metallization
Soldermask Opening
SMT Pad Detail
Scale: 2X
1 X This Rotation
1X Rotated 180^o
Component Outline
2X 0.2
9.4
2X 4.3
(2.8)
Stencil and
Metallization
Soldermask Opening
SMT Pad Detail
Scale: 2X
7 X This Rotation
7X Rotated 180^o
10X Rotated 90^o CW
10X Rotated 90^o CCW
9.55
6.88
Pin 1
0.8 0.95
Component Outline
0.5 Typ
12.55
9.88
1.0 Pitch
Typ
Pin 1
2X 5.8
(3.4)
0.5 Typ
12.4
1.0 Pitch
(4.3)
Typ
Component Outline
All measurements are in millimeters
Component Outline
0.25
Typ
Solder Mask Opening
Top View
Thermal Via Array.
∅0.3 mm on 0.6 mm pitch.
Additional vias in common ground
pad will improve thermal and
electrical performance.
NOTE: thermal vias should be tented
and filled with solder mask,
30-35 μm Cu plating recommended.
Metallization
Top View
Note: The cross-hatched area represents the merger of the center
ground pad +24 individual I/O ground pads. All I/O ground
pads should have at least one via connected to internal ground
planes for optimum electrical performance.
Figure 29. PCB Layout Footprint for the SKY73100-11 9 x 12 mm MCM
S1285
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
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April 15, 2009 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 200361B