SKY73021_08 Datasheet, PDF (15/18 Pages) Skyworks Solutions Inc. – 1700 – 2200 MHz High Gain and Linearity Diversity Downconversion Mixer for 2G/3G Base Station Transceiver Applications

36X 0.5
6.3
Pin 1
DATA SHEET • SKY73021 DOWNCONVERSION MIXER
6.3
36X 0.5
Component Outline
0.15
0.35
0.25
0.05 0.05
12X 0.075
24X 0.65
Stencil Aperture
Top View
12X 0.075
24X 0.65
Stencil and
Metallization
Soldermask Opening
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
0.75 0.85
Component Outline
SMT Pad Detail
Scale: 2X
9X This Rotation
9X Rotated 180o
9X Rotated 90o CW
9X Rotated 90o CCW
6.4
6.3
0.5
2X 2.795
Pitch
Typ
2X 2.795
6.3 4
6.4
3.8
1.9
1.9
3.8
Component Outline
0.25 Around
Ground Pins
4
Metallization
Top View
Note:The cross-hatched area represents the merger of the center
ground pad +10 individual I/O ground pads. All I/O ground
pads should have at least one via connected to internal ground
planes for optimum electrical performance.
Solder Mask Opening
Thermal Via Array.
Top View
∅0.3 mm on 0.5 mm pitch.
Additional vias in common ground
pad will improve thermal performance
NOTE: thermal vias should be tented
and filled with solder mask, 30-35 μm
Cu plating recommended.
All measurements are in millimeters
Figure 39. PCB Layout Footprint for the SKY73021 6 x 6 mm MCM
Component Outline
S1125
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
200450E • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • May 13, 2008
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