SE2593A20_15 Datasheet, PDF (14/18 Pages) Skyworks Solutions Inc. – Dual-Band 802.11n Wireless LAN Front-End

DATA SHEET
SE2593A20: Dual-Band 802.11n Wireless LAN Front-End
Preliminary Information
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PCB METAL & VIA HOLE
TOP (X-Ray) VIEW
PCB SOLDER MASK
TOP (X-Ray) VIEW
PCB SOLDER STENCIL
TOP (X-Ray) VIEW
PERIPHERAL PAD
PATTERN DETAIL
CL
CL
GENERAL NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCES CONFORM TO ASME Y14.5M-1994.
(UNLESS OTHERWISE SPECIFIED THE FOLLOWING VALUES APPLY)
DECIMAL TOLERANCE:
ANGULAR TOLERANCE:
X.X (1 PLC) ± 0.1mm
± 1°
X.XX (2 PLC) ± 0.05mm
X.XXX (3 PLC) ± 0.025mm
3. UNLESS SPECIFIED DIMENSIONS ARE SYMMETRICAL ABOUT CENTER LINES.
RECOMMENDED FOOTPRINT NOTES:
4. VIA HOLE INFORMATION:
4a. RECOMMENDED VIA HOLE SIZE (Ø): 0.150 - 0.300mm
4b. RECOMMENDED VIA HOLE PITCH: AS SHOWN
4c. RECOMMENDED VIA WALL Cu PLATING: 30-35um
4d. RECOMMENDED THAT VIAS BE TENTED WITH SOLDERMASK ON PCB BACKSIDE AND
FILLED WITH SOLDER.
4e. VIA IN SIGNAL PAD DETAIL, TYP 10 PLCS.
4f. TOTAL VIA COUNT AS SHOWN: 30.
5. SOLDER MASK GEOMETRY FEATURES:
5a. ALL PERIPHERAL PCB PADS ARE NON-SOLDER MASK DEFINED.
5b. ALL GROUND PADDLE FEATURES ARE SOLDER MASK DEFINED.
6. SOLDER STENCIL APERTURE FEATURES:
6a. SOLDER STENCIL APERATURE OPENINGS ARE SMALLER THEN PERIPHERAL PCB METAL PADS.
6b. RECOMMENDED SOLDER STENCIL APERTURE ARRAY TO TARGET APPROXIMATELY
50 - 80% COVERAGE OF SOLDER MASK OPENINGS, EXCEPT AS NOTED.
7. RECOMMENDED SOLDER STENCIL THICKNESS: 5.0mils (0.127mm).
8. PCB ACAD AND GERBER FILES AVAILABLE UPON REQUEST.
Figure 5: Recommended Land and Solder Patterns
Package Handling Information
Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly. The SE2593A20 is capable of
withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or
in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that
the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For
details on both attachment techniques, precautions, and handling procedures recommended, please refer to:
 “Land Grid Array Module Solder Reflow & Rework Information”, Document Number QAD-00046.
 “Handling, Packing, Shipping and Use of Moisture Sensitive LGA”, Document Number QAD-00047.
Caution! Class 0 ESD sensitive
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
202431A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 25, 2012
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