SKY73084-11 Datasheet, PDF (13/16 Pages) Skyworks Solutions Inc. – 300 - 500 MHz High Gain and Linearity Diversity Downconversion Mixer

6.3
Pin 36
Pin 1
DATA SHEET • SKY73084-11 DOWNCONVERSION MIXER
6.3
Component Outline
0.15
0.4
0.25
0.075 0.075
12X 0.062
Stencil and
Metallization
36X 0.875
Soldermask Opening
24X 0.125
12X 0.063
24X 0.125
36X 0.875
Stencil Aperture
Top View
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
0.75 0.9
Component Outline
SMT Pad Detail
Scale: 2X
9X This Rotation
9X Rotated 180o
9X Rotated 90o CW
9X Rotated 90o CCW
6.3
6.45
2X 2.775
2X 2.775
6.3
0.5
Pitch
Typ
6.45
3.88
Component Outline
0.25 Typ
Metallization
Top View
Thermal Via Array.
∅0.3 mm on 0.6 mm pitch.
Additional vias in common ground
Solder Mask Opening
Top View
pad will improve thermal and electrical
performance. NOTE: thermal vias
should be tented and filled with solder
mask, 30-35 μm Cu plating recommended.
Note:The cross-hatched area represents the merger of the center
ground pad +10 individual I/O ground pads. All I/O ground
pads should have at least one via connected to internal ground
planes for optimum electrical performance.
All measurements are in millimeters
Figure 35. PCB Layout Footprint for the SKY73084-11 6 x 6 mm MCM
Component Outline
S1125
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
200884F • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • April 3, 2009
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