SKY73025 Datasheet, PDF (12/15 Pages) Skyworks Solutions Inc. – 2300 – 2700 MHz High Gain and Linearity

PRELIMINARY DATA SHEET • SKY73025 DOWNCONVERSION MIXER
16X 0.5
6.3
Pin 1
6.3
16X 0.5
Component Outline
0.15
0.35
0.25
0.05 0.05
8X 0.075
8X 0.65
Stencil Aperture
Top View
8X 0.075
8X 0.65
Stencil and
Metallization
Soldermask Opening
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
0.75 0.85
Component Outline
SMT Pad Detail
Scale: 2X
9X This Rotation
9X Rotated 180o
9X Rotated 90o CW
9X Rotated 90o CCW
6.4
6.3
0.5
2X 2.795
Pitch
Typ
2X 2.795
6.3 4
6.4
3.8
1.9
1.9
3.8
Component Outline
0.25 Around
Ground Pins
4
Metallization
Top View
Note:The cross-hatched area represents the merger of the center
ground pad +9 individual I/O ground pads. All I/O ground
pads should have at least one via connected to internal ground
planes for optimum electrical performance.
Solder Mask Opening
Thermal Via Array.
Top View
∅0.3 mm on 0.5 mm pitch.
Additional vias in common ground
pad will improve thermal performance
NOTE: thermal vias should be tented
and filled with solder mask, 30-35 μm
Cu plating recommended.
All measurements are in millimeters
Figure 7. PCB Layout Footprint for the SKY73025 6 x 6 mm MCM
Component Outline
S1125
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
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September 21, 2007 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 200691C