SKY66293-21 Datasheet, PDF (11/13 Pages) Skyworks Solutions Inc. – 3400 to 3800 MHz High-Efficiency 4 W Power Amplifier

DATA SHEET • SKY66293-21: 3400 TO 3800 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
Pin 16
Pin 1 Indicator
0.20 X 45°
Pin 1
Stencil aperture size for center ground pad should be
80% to 100% (by area) of the solder mask opening
0.8 mm Pitch
5.3 mm
16X 0.5 mm
16X 0.67 mm
5.3 mm
9X ø0.875 mm
Pin 16
Pin 1
5.3 mm
0.6 mm Pitch
Package Outline
0.125 mm Typ
Stencil Aperture
Top View
7X 0.67 mm
7X 0.5 mm
Pin 16
Pin 1 Indicator
0.20 X 45°
Pin 1
5.4 mm
16X 0.6 mm
16X 0.77 mm
0.6 mm Pitch
Thermal via array Ø0.3 mm
on 0.6 mm pitch improves
thermal performance
Package Outline
0.8 mm Pitch
5.3 mm
0.25 mm Typ
0.8 mm Pitch
Package Outline
Opening size of 60% to 100%
of exposed center opening shown
5.4 mm
2X 1.4375 mm
2X 1.4375 mm
Notes:
Metallization
Top View
Solder Mask Opening
Top View
1. Thermal vias should be resin filled and capped in accordance with IPC–4761 type VII vias.
2. Recommended Cu thickness is 30 to 35 μm.
Figure 22. SKY66293-21 PCB Layout Footprint
203905-022
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
203905D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 31, 2017
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