SKY85736-11 Datasheet, PDF (10/13 Pages) Skyworks Solutions Inc. – 5 GHz WLAN Front-End Module

DATA SHEET • SKY85736-11: 5 GHz WLAN FRONT-END MODULE
Pin 24
Pin 1 Indicator
0.171 X 0.171 mm
Pin 1
4.7 mm
Package Outline
0.5 mm Pitch
2.7 mm
2X 0.6 mm
24X 0.275 mm
24X 0.25 mm
Exposed Center Pad
Stencil Aperture Size of
80 to 100% of the Module/Package
Solder Mask Openings
2X 1.6 mm
Stencil Aperture
(Top View)
Pin 24
Pin 1
4.7 mm
0.5 mm Pitch
Package Outline
0.25 mm Typ
Pin 24
Pin 1 Indicator
0.2 X 0.2 mm
Pin 1
4.8 mm
Package Outline
0.6 mm Pitch
2.7 mm
0.5 mm Pitch
2X 0.65 mm ^{2.8 mm}
15X 0.275 mm
15X 0.25 mm
Thermal via array
Ø0.3 mm on 0.6 mm pitch
improves thermal performance
Metallization
(Top View)
Notes:
0.6 mm Pitch
24X 0.375 mm
24X 0.35 mm
Exposed Center Pad
Opening Size of 60
to 100% of Exposed
Center Opening Shown
2X 1.65 mm
Solder Mask Opening
(Top View)
1. All measurements are in millimeters.
2. Thermal vias should be resin filled and capped in accordance with
IPC-4761 type VII vias. Recommended Cu thickness is 30 to 35 µm.
Figure 5. SKY85736-11 PCB Layout Footprint
(Top View)
203603-005
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
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February 13, 2017 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203603F