RM807 Datasheet, PDF (10/14 Pages) Skyworks Solutions Inc. – Power Amplifier Module for TDMA PCS (1850-1910 MHz)

Package and Handling Information
RM807
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed
prior to shipment. Instructions on the shipping container label must be followed regarding exposure
to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly.
The RM807 is capable of withstanding an MSL 3/225 °C solder reflow. Care must be taken when
attaching this product, whether it is done manually or in a production solder reflow environment. If
the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 225 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to temperatures exceeding 225 °C for more
than 10 seconds. For details on both attachment techniques, precautions, and handling procedures
recommended by Conexant, please refer to Application Note: PCB Design and SMT
Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles
can also be found in the JEDEC Standard J–STD–020A.
Production quantities of this product are shipped in the standard tape-and-reel format. For
packaging details, refer to Application Note: Tape and Reel, Document Number 101568.
Figure 9. Typical Case Markings
Mark Pin 1
Identifier
SKYWORKS
RM807-NN
NXXXXX.XX
YYWW MEX
Manufacturing Part Number-Revision Number
Lot Number
YY = Manufacture Year
WW = Week Package Sealed
MEX = Country Code
100409_006
10
Skyworks
100409F
February 7, 2002