SKY77643-11 Datasheet, PDF (1/2 Pages) Skyworks Solutions Inc. – Multimode Multiband Power Amplifier Module

PRODUCT SUMMARY
SKY77643-11 SkyLiTE^™ Multimode Multiband Power
Amplifier Module
Applications
• Multiband 3G / LTE handsets
• WCDMA Bands I, II, III, IV, V, VIII, IX
• TD-SCDMA Bands 34, 39
• FDD LTE Bands
1, 2, 3, 4, 5, 7, 8, 9, 12, 13, 17, 20, 28, 30
• TDD LTE Band 38, 39, 40, 41
Features
• Hybrid PA architecture
• Two T/R (RX) ports
• 14 RF outputs
• Industry-leading PAE for 3G/4G
• Optimized for APT DCDC operation
• Fully programmable Mobile Industry
Processor Interface (MIPI^®) control
• MIPI^® programmable bias modes optimize
best efficiency / linearity trade-off for 3G
and 4G; minimizes DG09 for 3G.
• Small, low profile package:
- 4.0 mm x 6.8 mm x 0.8 mm, Max.
- 42-pad configuration
Description
SkyLiTE^™ is Skyworks’ newest family of LTE devices which consists of highly
integrated modules incorporating the amplification, switching, WiFi filtering and
coupler functions required to support all major FDD/TDD bands. With the addition of
external duplexers, this product family provides OEMs with a scalable and
reconfigurable front-end system suitable for markets worldwide.
SKY77643-11 SkyLiTE^™ is a key building block for global or five-mode front-end
implementation. As a hybrid multimode multiband (MMMB) Power Amplifier Module
(PAM), the SKY77643-11 SkyLiTE^™ supports 3G / 4G handsets and operates
efficiently in WCDMA, TD-SCDMA, and LTE modes. The module is fully programmable
through a Mobile Industry Processor Interface (MIPI^®).
The module includes a WCDMA / LTE block for low, high, and mid-bands, a Multi-
Function Control (MFC) block, and the RF input/output ports are internally matched to
50 Ω loads to minimize external components. A CMOS integrated circuit utilizes
standard MIPI^® controls for the internal MFC interface and operation. Extremely low
leakage current maximizes handset standby time.
The InGaP die, the silicon die and passive components are mounted on a multi-layer
laminate substrate. The assembly is encapsulated in a 4.0 mm x 6.8 mm x 0.8 mm,
42-pad MCM, SMT package which allows for a highly manufacturable, low cost
solution.
3G: The SKY77643-11 SkyLiTE^™ supports WCDMA, High-Speed Downlink Packet
Access (HSDPA), High Speed Uplink Packet Access (HSUPA), High Speed Packet
Access (HSPA+), and TD-SCDMA modulations. Varying the input power level provides
control of output power. Adjusting the VCC using a DCDC converter maximizes
efficiency of each power level and modulation type.
4G: The SKY77643-11 SkyLiTE^™ supports 1.4, 3, 5, 10, 15, 20 MHz channel
bandwidths. Similar to 3G operation, varying the input power level provides control of
output power. Adjusting the VCC using a DCDC converter maximizes efficiency at each
power level.
3G / 4G Modulation scheme includes:
- WCDMA Voice Release 99
- HSDPA categories
- HSUPA
- HSPA+
- TD-SCDMA
- LTE 1.4, 3, 5, 10, 15, 20 MHz Channel BW
- TDD LTE
Skyworks Solutions, Inc. • Phone [781] 376–3000 • Fax [781] 376–3100 • [e-mail] • www.skyworksinc.com
203396E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • April 21, 2015
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