SKY77604 Datasheet, PDF (1/2 Pages) Skyworks Solutions Inc. – Multi-Mode / Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets

PRODUCT SUMMARY
SKY77604 Multi-Mode / Multi-Band Power Amplifier Module
for Next Generation GGE and HSPA Handsets
Applications
• Quad-band cellular handsets:
- Class 4 GSM850/EGSM900
- Class 1 DCS1800/PCS1900
- Class E2 GSM850/EGSM900/
DCS1800/PCS1900
- Class 12 multi-slot EGPRS
• Multi-band 3G handsets
• WCDMA/HSDPA/HSUPA-modulated handsets – Bands I, II, V, VIII
Features
• Hybrid architecture: separate GSM and WCDMA paths
• Separate single-ended GSM and WCDMA outputs, combined
single-ended GSM and WCDMA inputs, all AC-coupled
• Multiplexed voltage detector for GMSK, EDGE modes; coupler
output for 3G bands provided to transceiver for power control
• Fully programmable serial bus interface
• Final VCC stage for 2.5G/3G can attach to battery or buck
DC/DC
• Driver stage for 3G can attach to battery or buck DC/DC
• 2.5G features:
- EGPRS Class 12 multi-slot operation
- Linear power detector
- Linear PA with bias optimization for efficiency/linearity trade-
off in 8-PSK mode
• 3G features:
- WCDMA mode supports output power and bandwidth for
bands I, II, V, VIII
- Coupler output
- Linear balanced with bias optimization and low/high mode
gain switch for best efficiency/linearity trade-off
• Small, low profile package:
- 6 mm x 8 mm x 0.9 mm
- 34-pin configuration
Description
Skyworks SKY77604 is a hybrid multi-mode, multi-band Power
Amplifier Module (PAM) that supports 2.5G and 3G handsets, and
operates efficiently in GSM, EGPRS, EDGE WCDMA modes.
The PAM consists of a GSM800/EGSM900 PA block, a
DCS1800/PCS1900 PA block, separate WCDMA blocks for low
and high bands, RF input / output ports internally matched to
50 Ω to reduce the number of external components, and a Multi-
Function Control (MFC) block. A custom BiCMOS integrated circuit
provides the internal MFC interface and operation. Extremely low
leakage current maximizes handset standby time.
2.5G: The SKY77604 supports the GSM850, EGSM900, DCS1800,
and PCS1900 bands. The PAM also supports 2.5G Class 12
Enhanced General Packet Radio Service (EGPRS) multi-slot
operation and EDGE linear modulation.
3G: The SKY77604 uses Load Insensitive Power Amplifier (LIPA^®)
circuitry to support WCDMA, High-Speed Downlink Packet Access
(HSDPA), and High-Speed Uplink Packet Access (HSUPA)
modulation at a high antenna Voltage Standing-Wave Ratio
(VSWR). This functionality covers multiple bands for 3GPP
including bands I, II, V, VIII.
The module is fully programmable through a Serial Peripheral
Interface (SPI).
The InGaP die, the silicon die, and passive components are
mounted on a multi-layer laminate substrate. The assembly is
encapsulated with plastic overmold.
The SKY77604 is encapsulated in a 6 mm x 8 mm, 34-pad MCM,
Surface-Mounted Technology (SMT) package, which allows for a
highly manufacturable, low-cost solution. A functional block
diagram is shown in Figure 1.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
201243A • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • February 9, 2010
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