SKY77601 Datasheet, PDF (1/3 Pages) Skyworks Solutions Inc. – Multi-Mode, Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets

PRODUCT SUMMARY
SKY77601 Multi-Mode, Multi-Band Power Amplifier Module
for Next Generation GGE and HSPA Handsets
APPLICATIONS
• Quad-band cellular handsets:
- Class 4 GSM850/EGSM900
- Class 1 DCS1800/PCS1900
- Class E2 GSM850/EGSM900
- Class 12 multi-slot EGPRS
• Multi-band 3G handsets
• WCDMA/HSDPA/HSUPA-modulated handsets for bands I, II, V,
and VIII
FEATURES
• Hybrid architecture: separate GSM and WCDMA paths
• Separate single-ended GSM and WCDMA inputs/outputs, all AC-
coupled
• Multiplexed voltage detector for all modes/bands provided to
transceiver
• Fully programmable serial bus interface
• Final VCC stage for 2.5G/3G can be attached to battery or buck
DC/DC
• Driver stage for 3G can be attached to battery or buck DC/DC
• 2.5G features:
- EGPRS Class 12 multi-slot operation
- Log power detector
- Linear PA with bias optimization for efficiency/linearity trade-
off in 8-PSK mode
• 3G features:
- WCDMA mode supports output power and bandwidth for
bands I, II, V, and VIII
- Linear detector
- Linear balanced with bias optimization and low/high mode
gain switch for best efficiency/linearity trade-off
• Small footprint, MCM (34-pin, 6 x 8 mm) Pb-free (MSL3, 260 °C
per JEDEC J-STD-020) SMT package
DESCRIPTION
Skyworks SKY77601 is a hybrid multi-mode, multi-band Power
Amplifier Module (PAM). The device is intended to support 2.5G
and 3G handsets and operates efficiently in GSM, EGPRS, EDGE
WCDMA modes.
For 2.5G, the SKY77601 supports the GSM850, EGSM900,
DCS1800, and PCS1900 bands. The device also supports 2.5G
Class 12 Enhanced General Packet Radio Service (EGPRS) multi-
slot operation and EDGE linear modulation.
For 3G, the PAM uses Load Insensitive Power Amplifier (LIPA^®)
circuitry to support WCDMA, High-Speed Downlink Packet Access
(HSDPA), and High-Speed Uplink Packet Access (HSUPA)
modulation at a high antenna Voltage Standing-Wave Ratio
(VSWR). This functionality covers multiple bands for 3GPP
including bands I, II, V, and VIII.
RF input and output ports are internally matched to 50 Ω to
reduce the number of external components. Extremely low
leakage current maximizes handset standby time.
The InGaP die, the silicon die, and passive components are
mounted on a multi-layer laminate substrate. The assembly is
encapsulated with plastic overmold.
The device is mounted in a 34-pin, 6 x 8 mm MCM Surface-
Mounted Technology (SMT) package, which allows for a highly
manufacturable low-cost solution. A block diagram of the
SKY77601 is shown in Figure 1. The device package and pinout
for the 34-pin MCM are shown in Figure 2.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
201241A • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • February 9, 2010
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