42-DL213B Datasheet, PDF (5/6 Pages) Silicon Touch Technology Inc. – Optical Fiber Transmitting IC

點晶科技股份有限公司
SILICON TOUCH TECHNOLOGY INC.
REQUIREMENTS FOR WAFER DELIVERY
Material： Silicon with P-Substrate
Diameter： 6 inches(≒15cm)
Thickness： 15 mils(≒381um)
Malfunctioned die：Marked with red ink or equivalent marking
42-DL213B
HANDLING RECOMMENDATION FOR STATIC ELECTRICITY PROTECTION
(1) Avoid any circumstance that produce static electricity, e.g. rubbing against plastic, during
moving, storing and processing 42-DL213B.
(2) Process 42-DL213B in a clean room with proper temperature and humidity.
(3) Ground all working machines and workers wear anti-electrostatic ring to ground during
processing.
(4) Avoid contact 42-DL213Bwith bare hands .If unavoided, wear anti-electrostatic ring and use
anti-electrostatic tool to pick it up.
GUARANTED TEMPERATURE AND RETENTION CYCLE
(1) The device/wafer 42-DL213B should be stored in the nitrogenous chest. The conditions
suggested are as follows:
Temperature = 23±3℃
Relative Humidity = 50±10%
Minimum nitrogen inflow = 3 liters/minute
(2) If the device/wafer, 42-DL213B is incidentally exposed to the air, use it for manufacturing as
soon as possible.
(3) Under the storage environment specified in item (1), six-month safe storage period is
guaranteed.
SP-DL213B-A.003
-4-
Version：A.003